Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

IoPP introduces four $2,500 scholarships for packaging students

The Institute of Packaging Professionals is proud to offer four $2,500 academic scholarships to recognize exceptional college students headed for a career in packaging.

These scholarships were created to support packaging education and to raise awareness of packaging as a career choice. The credentials of the top talent identified through this program will be shared with IoPP benefactor companies as a recruiting tool for their organizations.

“We are proud to lead this initiative to recognize the packaging industry’s future young professionals,” says Patrick Farrey, IoPP Executive Director. “This program paves the way for the next step, a mentoring program that fosters the career development process and connects tomorrow’s leaders with those of today.”

Candidates must be students in their Junior or Senior year pursuing a degree at an accredited college, university, or vocational/technical school in a course of study relevant to a career in the packaging field. The scholarships are applicable for the 2010-2011 academic year. Students should send completed applications to: Packaging Education Scholarship Fund, c/o Institute of Packaging Professionals, 1833 Centre Point Circle, Suite 123 Naperville, IL 60563. All materials must be completed and postmarked no later than April 15, 2010. Incomplete applications will not be considered. Recipients will be announced in May.

The four inaugural scholarships are funded through the support of the Minnesota, Tejas, and Chicago IoPP chapters along with IoPP benefactor companies and individual contributions. For more information, please contact Sarah Washburn at 630/544-5050, [email protected], or www.iopp.org/scholarshipfund.

Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report