Scheduled for 10 a.m., Chicago time, Tuesday, Nov. 9, the end-user roundtable discussion planned for the TAPPI SuperCorr Expo in Atlanta will be interactively broadcast to a room convenient to Pack Expo. The Virtual Classroom link is being provided courtesy of Hewlett-Packard. The specific room will be available at Pack Expo information booths.
Among the topics for the discussion will be ECT and Mullen standards for corrugated board and how well they work for non-domestic markets. Participants will be asked if they use other ways to specify corrugated to converters outside the United States. In addition, the roundtable will explore the shift from palletized loads going to warehouses/stores compared to direct shipments to customers and what it means for packaging specs and for recovery of old corrugated containers, reports Andy Kerr of Eastman Kodak, chairman of the TAPPI End-User Committee. For more information, contact [email protected].
