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Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

Two students were honored with a $2귔 award and a $500 travel grant to attend Worldwide Food Expo in Chicago this year by The Foundation of the Intl.

Assn. of Food Industry Suppliers. The McLean, VA organization’s Food Engineering Scholarships for the 2003-2004 academic year were awarded to food engineering majors Leah Beth Maxwell at Purdue University, and Jason Lewis Myhre of the University of Florida. For more information, contact IAFIS at 703/761-2600, or visit www.iafis.org.

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Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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Annual Outlook Report: Workforce