IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

Two students were honored with a $2귔 award and a $500 travel grant to attend Worldwide Food Expo in Chicago this year by The Foundation of the Intl.

Sep 30, 2003

Assn. of Food Industry Suppliers. The McLean, VA organization’s Food Engineering Scholarships for the 2003-2004 academic year were awarded to food engineering majors Leah Beth Maxwell at Purdue University, and Jason Lewis Myhre of the University of Florida. For more information, contact IAFIS at 703/761-2600, or visit www.iafis.org.

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IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

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Redefine What’s Possible in Packaging & Processing—Register Now & Save!

Discover Leading Suppliers

The packaging innovations from PACK EXPO worth your attention.

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