New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.
Start Your Search

IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

Two students were honored with a $2귔 award and a $500 travel grant to attend Worldwide Food Expo in Chicago this year by The Foundation of the Intl.

Assn. of Food Industry Suppliers. The McLean, VA organization’s Food Engineering Scholarships for the 2003-2004 academic year were awarded to food engineering majors Leah Beth Maxwell at Purdue University, and Jason Lewis Myhre of the University of Florida. For more information, contact IAFIS at 703/761-2600, or visit www.iafis.org.

Discover Our Content Hub
Access Packaging World's free educational content library!
Unlock Learning Here
Discover Our Content Hub
Test Your Smarts
Take Packaging World's sustainability quiz to prove your knowledge!
Take Quiz
Test Your Smarts