IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

Two students were honored with a $2귔 award and a $500 travel grant to attend Worldwide Food Expo in Chicago this year by The Foundation of the Intl.

Sep 30, 2003

Assn. of Food Industry Suppliers. The McLean, VA organization’s Food Engineering Scholarships for the 2003-2004 academic year were awarded to food engineering majors Leah Beth Maxwell at Purdue University, and Jason Lewis Myhre of the University of Florida. For more information, contact IAFIS at 703/761-2600, or visit www.iafis.org.

Worldwide Food Expo

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Products

Two clear plastic flip-top dispensing caps with ribbed bases and hinged lids

IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

Worldwide Food Expo

Discover Leading Suppliers

Video Explainer on Thermoforms and Vacuum Packs for Proteins

A Video Overview of Liquid Filling Machines

What Can You Package on a Vertical Form/Fill/Seal Machine?

Quality Control Masters: The Ultimate Guide to Packaging Inspection Equipment

End of the Line Video Series: EPR Fees and Their Implications, a Biodegradable Face Mask, and More

Müller UK & Ireland, Telefónica, and Ultradent Products Reduce Packaging

CPG Innovator: PepsiCo’s Hayden Bivens

Designing Packaging for Regulations That Keep Moving

ACTEGA: Packed with Expertise for every surface. Let's Talk Packaging

Flip-Top Closure for Dish Soap and Personal Care

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