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IAFIS AWARDS FOOD ENGINEERING SCHOLARSHIPS

Two students were honored with a $2귔 award and a $500 travel grant to attend Worldwide Food Expo in Chicago this year by The Foundation of the Intl.

Assn. of Food Industry Suppliers. The McLean, VA organization’s Food Engineering Scholarships for the 2003-2004 academic year were awarded to food engineering majors Leah Beth Maxwell at Purdue University, and Jason Lewis Myhre of the University of Florida. For more information, contact IAFIS at 703/761-2600, or visit www.iafis.org.

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Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
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Coding, Marking, and Labeling Innovations Report