Best of the 2019 Top to Top Summit

Onsite coverage from PMMI's 14th annual Top to Top Summit, with its largest-ever CPG and OEM audience.

Dec 19, 2019

Editors from Packaging World, ProFood World and OEM Provide an inside view into the 2019 Top to Top Summit. Conversations at the summit focused on Artificial Intelligence, CPGs, robots, AR/VR and the challenges unique to the supplier-buyer relationship.

If you missed the summit or are looking for a comprehensive recap, fill out the form below to download the free PDF.

Machinery Basics

Learn About 4 Different Types of Wrapping Machines for Your Product

10 Different Types of Labeling Machines for Your Product

What are the Different Types of Multipacking Equipment?

Get a Quick Overview of Conveyors

Sarah Dumont (left) and Ezekiel Guevarra (right) received scholarships for distinguished performance in Clemson's Packaging Science program.

Clemson Announces Spring 2024 Outstanding Packaging Science Senior Award Winners

Clemson University announces two Spring 2024 awards. Sarah Dumont is the Robert Testin Outstanding Senior in Packaging Science winner, and Ezekiel Guevarra becomes the Packaging World Outstanding Packaging Science Senior.

Cloud data storage can act as a backup for disaster recovery.

Data and Analytics Management Varies Across Companies

8 Ways You Might Be Greenwashing Your Packaging And Not Even Know It

All seven Nesquik flavors will be available with the new recyclable shrink-sleeve label by June of this year.

Nesquik’s New Shrink-Sleeve Labels Make Packaging 100% Recyclable

How CooperVision Streamlined Packaging Artwork Management

How AI is reshaping CPG manufacturing operations

Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.

How Can You Honor a Leader?

Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago

Products

Best of the 2019 Top to Top Summit

Learn About 4 Different Types of Wrapping Machines for Your Product

10 Different Types of Labeling Machines for Your Product

What are the Different Types of Multipacking Equipment?

Get a Quick Overview of Conveyors

Clemson Announces Spring 2024 Outstanding Packaging Science Senior Award Winners

Data and Analytics Management Varies Across Companies

8 Ways You Might Be Greenwashing Your Packaging And Not Even Know It

Nesquik’s New Shrink-Sleeve Labels Make Packaging 100% Recyclable

How CooperVision Streamlined Packaging Artwork Management

Paper Pouch Packaging System

HMI Systems for Industrial Automation

Solid-Top, Heavy-Duty Pallet

Mar/Apr 2024

Craft Brew 2024

PACK EXPO East Showcase 2024

Jan/Feb 2024

8 Ways You Might Be Greenwashing Your Packaging And Not Even Know It

Special Report: How Artificial Intelligence Can Improve CPG Manufacturing Operations

Cartoning eBook

Cobot Palletizers