PACK EXPO debut for OEM packaging group

ITW Dynatec restructured its operations to establish a dedicated packaging group exclusively focused on the needs of packaging original equipment manufacturers (OEMs) and end user companies.

Aug 28, 2015

The company will feature its growth-oriented solutions for the packaging market at Pack Expo 2015, Las Vegas Convention Center, Las Vegas, NV, September 28-30, Booth C-3301.

In addition to Scott Holzwarth, Global Business Unit Manager - Packaging for ITW Dynatec, a group of ITW Dynatec hot melt experts and technicians will be attending Pack Expo this year.

ITW Dynatec invites all attending and exhibiting packaging OEMs and manufacturers to its hospitality suite, which will be open throughout the Pack Expo show in the North Hall. Complimentary refreshments and lunch will be provided to all attending packaging customers and prospects, where they can also learn about ITW Dynatec’s exclusive partnership and support programs.

ITW Dynatec

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