Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Ampac : High-barrier coextruded films

Dow Chemical and Ampac Flexibles combined efforts to develop high-barrier coextruded films containing Saran™ brand polyvinylidene chloride resins for a variety of applications. Using multilayer coextruded film technology made from Saran resins, Ampac will be able to participate in new application areas by selling higher performing films.

Pw 12234 Extruder

Different cost-effective film structures can be produced that offer a barrier alternative to PVDC-coated paper, A10-coated PET, EVOH-Nylon, foil, metallized OPP, and other substrates.

Fill out the form below to request more information about Ampac : High-barrier coextruded films
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO
The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here