New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

AIPIA World Congress Announces Speaker Line-Up

The event, to be held in Amsterdam, November 14-15, will feature Inuru, specialists in OLED labelling and dynamic surfaces for packaging. It joins Crane Automation, Omron, and Zebra Technologies as one of the major sponsors of the event.

Aipia Congress Speaker Session

Inrur will make the opening keynote on the Smart Futures Stage on day one of the AIPIA World Congress, when Marcin Ratajczak will delve into the aesthetic allure of OLED, highlighting its seamless integration into standard labelling processes and equipment, achieved through the ingenious combination of printed and hybrid electronics.

In a panel Zappar will be joined by Unilever and the Royal National Institute for the Blind (RNIB) to explain and discuss how packaging is addressing accessibility for all using an accessible QR code which can deliver information to those who are visually impaired.

Elaine Wilkinson of Zebra Technologies will then explore how to harness environmental sensors and indicators for intelligent packaging across the supply chain. While Max Kabalisa and Jean-Pierre Amorij, both from Unicef, will show how serialized vaccine scans in Africa are a milestone in tackling falsified medical products.

Delegates will then get the chance to hear how Checkpoint Systems has collaborated with McDonald’s France to implement food-safe RFID technology into its new reusable containers – a move hoped to keep track of the packaging, optimize the restaurant’s reusable system, and reduce waste.

The afternoon of day one continues with Dominique Guinard of Digimarc discussing how the world is Getting Ready for the Sunrise of 2D Barcodes as retailers and consumer brands across industries prepare for Sunrise 2027. And to conclude proceedings on the Main Stage on day one Patricia Torres, Omron Europe will ask: Closing the circle: Is your packaging smart enough for circularity?

Meanwhile on the Smart Insights Stage on day one speakers from Wiliot (ambient IoT), Antares Vision (supply chain transparency), and STMicroelectronics (NFC connected packaging) will set the tone of the morning, while after lunch and browsing the 20+ stands delegates can then learn all about the evolution of product identification from Laava.

Toppan will then talk about the integration of NFC into packaging and Systech will explain how existing packaging can be made to work harder and smarter! After the break Blockstore will reveal how frictionless shopping can be both more efficient and less wasteful. The Smart Insights Stage activities on day one end with a 360 degree focus – e-label & directives + sustainability + product security by Nina Zehetmaier of Securikett.

Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub
Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
Read More
Discover innovations from 400+ packaging & processing suppliers.