New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Avery Dennison: Topcoat for films

Avery Dennison Label and Packaging Materials launches TC-2000 topcoat for films designed for a variety of technologies including water-based flexo, UV flexo, UV screen, UV inkjet, solvent gravure, and letterpress.

Example of usage of TC-2000 topcoat
Example of usage of TC-2000 topcoat

TC-2000 is designed to deliver solid, consistent performance that will enable converters to leverage digital printing for greater flexibility and quality output, simplifying their ordering and stocking needs.

TC-2000 builds on the success of Avery Dennison’s popular TC-1000 topcoat with improved ink anchorage to enhance on-press efficiency gains and improves profit margins by eliminating the need to corona treat or prime in UV print platforms. It creates an extremely strong bond between ink and film, allowing heavier inks to be laid down to achieve sharp images and bold looks.

It allows designers a greater range of creativity, such as using bold typefaces to replace images, the use of gradients, or building on brand stories and histories that utilize vintage photos, seals and retro-inspired typography to help a brand stand out from its competition.

“TC-2000 is the result of the extensive global research and development and investment in material science—hallmarks of Avery Dennison’s commitment to excellence,” said Cory Keller, Senior Product Manager, Digital, Avery Dennison. “As new printing technologies come of age, it is our goal to help converters and brand owners take advantage of the benefits they afford while remaining committed to compatibility with existing technologies.”

Fill out the form below to request more information about Avery Dennison: Topcoat for films
Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?