Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Replace labels, save money with direct carton marking

VIAjet™ T-Series high resolution printers represent the latest industrial inkjet technology available, providing exceptional print resolution and versatility along with unparalleled levels of readability. The T-Series is a cost-effective alternative to adhesive labels and pre-printed corrugated boxes.

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers