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Digital print for blister pack lidstock
The Digiline Blister Nearline module from Atlantic Zeiser is a fully digital system for late-stage customization of lidding material to be applied to blister packs. Change from one print job to another in minutes.
May 23, 2014
Machinery Basics
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read MoreHow AI is reshaping CPG manufacturing operations
Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
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