Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Digital print for blister pack lidstock

The Digiline Blister Nearline module from Atlantic Zeiser is a fully digital system for late-stage customization of lidding material to be applied to blister packs. Change from one print job to another in minutes.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers