NEW EVENT! Cutting-edge Trends for Every Industry at PACK EXPO Southeast
Discover packaging & processing solutions for all industries at the all-new PACK EXPO Southeast in Atlanta, GA, March 10-12, 2025

Balluff: Modular sensor expansion system

Balluff's IO-Link system enables quick and easy expansion or simplification of Profibus and Profinet networks.

Pw 5826 Webbaluff2
An expansion module attaches directly to the Profibus or Profinet network, either as a new node or by substituting it for an existing node. Then, using standard low cost 3-conductor M12 cordsets, attach up to four intelligent IO-Link sensors up to 20 meters away from the Balluff IO-Link expansion module. Hardware includes network expansion modules, sensor hubs, standard M12 non-shielded 3-conductor cordsets, standard sensors, and intelligent IO-Link sensors. Sensors are available in a range of different sensing technologies, including distance feedback, RFID, and pressure monitors.
Fill out the form below to request more information about Balluff: Modular sensor expansion system
New e-book on Flexible Packaging
In this e-book, you’ll learn key considerations for vertical and horizontal f/f/s and how to choose between premade bags and an f/f/s system. Plus, discover the pitfalls to avoid on bagging machinery projects.
download
New e-book on Flexible Packaging
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast
The exciting new PACK EXPO Southeast 2025 unites all vertical markets in one dynamic hub, generating more innovative answers to your production challenges. Don’t miss this extraordinary opportunity for your business!
Read More
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast