See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,700 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW

Balluff: Modular sensor expansion system

Balluff's IO-Link system enables quick and easy expansion or simplification of Profibus and Profinet networks.

Pw 5826 Webbaluff2
An expansion module attaches directly to the Profibus or Profinet network, either as a new node or by substituting it for an existing node. Then, using standard low cost 3-conductor M12 cordsets, attach up to four intelligent IO-Link sensors up to 20 meters away from the Balluff IO-Link expansion module. Hardware includes network expansion modules, sensor hubs, standard M12 non-shielded 3-conductor cordsets, standard sensors, and intelligent IO-Link sensors. Sensors are available in a range of different sensing technologies, including distance feedback, RFID, and pressure monitors.
Fill out the form below to request more information about Balluff: Modular sensor expansion system
Retail multipack suppliers, all in one place
25+ vetted systems for cups, tubs, and bottles — shrink, paperboard, banding, clip, and more. Free download.
Read More
Retail multipack suppliers, all in one place
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,700 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW
Discover How to Stay Ahead of the Competition at PACK EXPO International