Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

G2: G2: Antenna designs

RSI ID Technologies (RSI), has developed four new antenna designs featuring NXP’s next-generation UCODE G2X IC.

The RSI designs, Corkscrew, Interval, KAT2, and Cube2, have been developed to work interchangeably with both the standard and expanded memory chips from NXP. The new antenna designs offer flexibility in the selection of the IC memory based on the application requirements. RSI ID Technologies selected NXP UCODE G2X silicon for passive smart tags and labels based on its reliable operation on different materials, across very long read ranges and in dense reader environments. The G2 XM and XL ICs from NXP offer scalable EPC numbers up to 240 bits and an expanded memory chip that offers an additional 512 bits of user defined memory, which is a benefit for both standard applications and those that require additional memory capacity.

Fill out the form below to request more information about G2: G2: Antenna designs
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce