Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

ID Technology becomes exclusive U.S. distributor

ID Technology has signed an exclusive U.S. distributor agreement for the Electronic Printing Development (EPD) line of thermal transfer overprinters.

Ideal for printing onto PD, PP, paper, and Tyvek, thermal transfer overprinting results in a sharp, clear image without compromising production speed. ID Technology will distribute the S Model and Communicator thermal transfer overprinters as part of its complete line of labeling, coding, and marking products.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers