Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

A place where next-gen packaging professionals are trained

Research has been the theme here at the 18th World Packaging Conference, an event hosted by the Packaging Program at California Polytechnic State University in San Luis Obispo, CA.

Evan Cernokus, a grad student in Cal Poly's Packaging Program, demonstrates testing equipment in the Cal Poly labs.
Evan Cernokus, a grad student in Cal Poly's Packaging Program, demonstrates testing equipment in the Cal Poly labs.

From June 18 through June 21 a barrage of presentations are being delivered at this IAPRI (International Association of Packaging Research Institutes) event, some describing technologies that are positively pie in the sky and others being so close to commercialization you can just bet you’ll be reading about them a lot more in this space in the months to come.

But one of the real treats was yesterday’s post-lunch tour of the campus, when we had access to a number of students who are either just graduating from Cal Poly’s Packaging Program or are still here in post-grad work. Memorable bits of the day include these:

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers