New Tool: ProSource
Check out our packaging and processing solutions finder, ProSource.

Embedded PCs

Beckhoff's new CX5600 Series features AMD Ryzen processors, additional interfaces, and wide-ranging automation applications.

Beckhoff Cx5600

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

The new CX5600 Embedded PC series expands Beckhoff’s machine control line with powerful AMD Ryzen processors, additional interfaces and operating system options. Retaining the same form factor as previous generations, these DIN rail-mounted embedded PCs provide the flexibility to support an even greater range of applications that require PLC, HMI, motion control, and more.

The Beckhoff CX5600 series includes two device versions, both with AMD Ryzen processors: CX5620 (1.2 GHz) and CX5630 (2.0 GHz). Beyond low power consumption, the fanless embedded PCs deliver many standard features:

  • Two independent Gbit Ethernet interfaces
  • Four USB 3.0 interfaces
  • One DVI-D interface
  • A flexibly assignable multi-option interface ex-factory
  • 4 GB or 8 GB RAM options

The system can be expanded on the left-hand side with a CX2500 module. This enables the simple addition of further PC interfaces, such as two additional 1 GB Ethernet ports, or fieldbus interfaces as needed. With an extended operating temperature range from -25 C to +60 C, the CX5600 series devices can be used even in applications with demanding climates.

With TwinCAT 3 automation software, the management in the TwinCAT real-time kernel ensures that sufficient time remains for executing the human-machine interface (HMI) in addition to executing the real-time control tasks in one CPU. The high performance of the graphics kernel integrated in the processor supports demanding visualizations, including advanced user interfaces.

The CX5600 devices offer further flexibility with multiple operating system options. These include Windows 10 and the TwinCAT/BSD alternative OS from Beckhoff.

Fill out the form below to request more information about Embedded PCs
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?
Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub