Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Siemens Industry Inc: Wireless I/O and module

Siemens’ Simatic® ET 200pro IWLAN saves communication cabling and installation costs by delivering wireless connectivity from any distributed I/O station. Compatible with Siemens’ complete line of ET 200pro I/O and specialty modules, the IP67-rated IWLAN interface can be directly mounted on a machine, eliminating the need for installation inside an electrical enclosure. The design supports deterministic iPCF (Industrial Point Coordination Function) for critical industrial Ethernet communications using standard PROFINET protocol.
Fill out the form below to request more information about Siemens Industry Inc: Wireless I/O and module
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this month to experience a breakthrough in packaging and processing.
REGISTER NOW
Break out of the ordinary: see what’s new in packaging & processing!
2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports