New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Engineering design

Engineer's Aide(TM) version 3.2 from Epcon Intl. (Woodsfield, OH) is a process system design software that provides comprehensive equipment sizing and fluid flow simulation capabilities.

Pw 25782 Eng Aidver 45

Includes Smart-draw(TM), a model piping process program, as well as DIPPR®, a database providing information on 40 properties of over 1군 fluids.

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Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
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How Can You Honor a Leader?
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Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
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