Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Pilz International: Safety fieldbus

Pilz’s (Farmington Hills, MI) new PSS SB DI16 is a remote digital input module that provides 16 inputs for the Pilz SafteyBUS p® safe fieldbus system to control decentralized safety-device applications such as light curtains, safety gates or E-Stops.

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A total of 1008 I/Os can be connected through 63 of these modules. Said to make safety applications economical by integrating diagnostic functions using only one cable for all safety device hookups.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers