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PackML + PackSpec = packaging’s future

A joint meeting of the Organization for Machine Automation & Control’s PackML and PackSpec committees recently took place in Atlanta.

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As reported here by Automation World’s David Greenfield, it included a workshop moderated by OMAC board member, P&G’s Dan Amundson.

Dan asked the participants what Packaging World magazine would be reporting about PackML five years in the future.  The resulting marker sketches were transformed by Packaging World art director Dave Bacho into the hypothetical cover layout you see here.

Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
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Conveying Innovations Report
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
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Annual Outlook Report: Automation & Robotics