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PackML + PackSpec = packaging’s future

A joint meeting of the Organization for Machine Automation & Control’s PackML and PackSpec committees recently took place in Atlanta.

Pw 51887 Packworld 0117

As reported here by Automation World’s David Greenfield, it included a workshop moderated by OMAC board member, P&G’s Dan Amundson.

Dan asked the participants what Packaging World magazine would be reporting about PackML five years in the future.  The resulting marker sketches were transformed by Packaging World art director Dave Bacho into the hypothetical cover layout you see here.

New e-book on Flexible Packaging
In this e-book, you’ll learn key considerations for vertical and horizontal f/f/s and how to choose between premade bags and an f/f/s system. Plus, discover the pitfalls to avoid on bagging machinery projects.
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New e-book on Flexible Packaging
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast
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INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast