PackML + PackSpec = packaging’s future

A joint meeting of the Organization for Machine Automation & Control’s PackML and PackSpec committees recently took place in Atlanta.

Apr 3, 2013

As reported here by Automation World’s David Greenfield, it included a workshop moderated by OMAC board member, P&G’s Dan Amundson.

Dan asked the participants what Packaging World magazine would be reporting about PackML five years in the future. The resulting marker sketches were transformed by Packaging World art director Dave Bacho into the hypothetical cover layout you see here.

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PackML + PackSpec = packaging’s future

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