Attend PACK EXPO – this year’s can’t-miss event in Chicago, Oct 23-26.
Discover solutions from 2,000+ exhibitors to advance your operations and network with colleagues at PACK EXPO International.


Clemson University will host “Packaging Fundamentals,” Nov. 4-6, and “Managing Packaging Development,” Nov. 6-7. The former seminar will cover packaging materials, laws, regulations, testing, and environmental issues.

The latter will cover a systematic and integrated packaging development approach, involving production, marketing, packaging engineering, packaging suppliers, sales, and purchasing. Details are available at, or by calling Dr. Scott Whiteside at 864/656-6246.

Test Your Smarts
Take Packaging World's sustainability quiz to prove your knowledge!
Take Quiz
Test Your Smarts
New Labeling Playbook
Read tips for purchasing labeling equipment & considerations for your most successful labeling project ever.
Read More
New Labeling Playbook