FROM PACK EXPO 2008: Nordson showcases its eco-friendly adhesive application concept, consisting of depositing foaming and stitching beads of adhesive, reducing adhesive usage.
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago