Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

ID Technology: ID Technology: New thermal transfer overprinter increases profitability

ID Technology, a division of Pro Mach and a leading provider of labeling, coding and marking solutions, has released the COM II – a versatile thermal transfer overprinting solution for flexible packaging in high volume manufacturing environments.

The COM II 300dpi print head produces sharp, high-quality text, bar codes, logos and Data Matrix codes. This printer is suited to high speed production lines and has been designed to integrate seamlessly into a wide range of flexible packaging machines including vertical and horizontal form/fill/sealers. Simple technology provides consistency with low maintenance requirements, increasing profitability and equipment effectiveness. Built-in intelligence eliminates the need for an attached controller. Instead communication with the printer is accomplished using a PC with web browser software, existing OEM interface or an optional, simple to use touch screen. The COM II has easy, onboard label creation software and multiple message storage, enabling quick and simple message changeover.  For further cost savings, the patented variable Ribbon Economy function reduces the amount of ribbon used per print without compromising on print resolution. Ribbon retraction feature minimizes the gap between prints, ensuring maximum efficiency of ribbon usage. The COM II has a maximum print speed of 1400mm/sec, uses 1400 meter length ribbon and has a print area of up to 128mm wide x 2400mm long. 

Videos from ID Technology, a ProMach product brand
Fill out the form below to request more information about ID Technology: ID Technology: New thermal transfer overprinter increases profitability
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here