Thermoformer prepared for Industry 4.0

Across the PACK EXPO show floor, one theme that cropped up again and again was ease of use. Due to the difficulty of finding labor, especially skilled labor, in today’s manufacturing environment, packagers are looking for equipment that is easy to set up, operate, and troubleshoot. Multivac’s new X-Line thermoformer provides such features and has also been engineered to meet the requirements of Industry 4.0. For the latter, Multivac says it is looking for partners to fully implement the technology.

According to the company, the X-Line offers maximum packaging reliability, more consistent pack quality, and a higher level of process speed, as well as easy and reliable operation. Among its features are seamless digitalization, a comprehensive sensor system, and networking with the Multivac Cloud and Smart Services.

For maximum flexibility and uptime, the X-Line has ability to change package configurations in less than 10 minutes. Additionally, the X-Line’s connection to the Multivac Cloud gives users access to Pack Pilot and Smart Services, which provide a constant connection and up-to-date information on software, film availability, machine settings, and other pertinent data that enable the machine to be used even without special operator knowledge.

The X-Line comes with X-MAP, a gas flushing process that can be precisely controlled for packing with modified atmosphere. Finally, users can operate the X-Line through its intuitive HMI 3 multi-touch interface that corresponds to the operating logic of today’s mobile devices. The HMI 3 can be set up for individual operators, including different access rights and operating languages.