Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Digital TIJ ink for non-porous substrates

New ink from Code Tech for digital thermal ink-jet coding is for use in HP disposable ink-jet cartridges. This is a thermal resin ink that dries by adhesion as opposed to evaporation, which makes it suitable for a variety of non-porous substrates.

The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce