Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
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Digital TIJ ink for non-porous substrates

New ink from Code Tech for digital thermal ink-jet coding is for use in HP disposable ink-jet cartridges. This is a thermal resin ink that dries by adhesion as opposed to evaporation, which makes it suitable for a variety of non-porous substrates.

Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—<i>Packaging World</i> editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
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Annual Outlook Report: Sustainability
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!