Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Balluff: Modular sensor expansion system

Balluff's IO-Link system enables quick and easy expansion or simplification of Profibus and Profinet networks.

Pw 5826 Webbaluff2
An expansion module attaches directly to the Profibus or Profinet network, either as a new node or by substituting it for an existing node. Then, using standard low cost 3-conductor M12 cordsets, attach up to four intelligent IO-Link sensors up to 20 meters away from the Balluff IO-Link expansion module. Hardware includes network expansion modules, sensor hubs, standard M12 non-shielded 3-conductor cordsets, standard sensors, and intelligent IO-Link sensors. Sensors are available in a range of different sensing technologies, including distance feedback, RFID, and pressure monitors.
Fill out the form below to request more information about Balluff: Modular sensor expansion system
The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO