Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

G2: G2: Antenna designs

RSI ID Technologies (RSI), has developed four new antenna designs featuring NXP’s next-generation UCODE G2X IC.

The RSI designs, Corkscrew, Interval, KAT2, and Cube2, have been developed to work interchangeably with both the standard and expanded memory chips from NXP. The new antenna designs offer flexibility in the selection of the IC memory based on the application requirements. RSI ID Technologies selected NXP UCODE G2X silicon for passive smart tags and labels based on its reliable operation on different materials, across very long read ranges and in dense reader environments. The G2 XM and XL ICs from NXP offer scalable EPC numbers up to 240 bits and an expanded memory chip that offers an additional 512 bits of user defined memory, which is a benefit for both standard applications and those that require additional memory capacity.

Fill out the form below to request more information about G2: G2: Antenna designs
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO
Is your palletizing solution leaving money on the floor?
Discover which palletizing technology—robotic, conventional, or hybrid—will maximize your packaging line efficiency while minimizing long-term costs in this comprehensive analysis.
Read More
Is your palletizing solution leaving money on the floor?