New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

G2: G2: Antenna designs

RSI ID Technologies (RSI), has developed four new antenna designs featuring NXP’s next-generation UCODE G2X IC.

The RSI designs, Corkscrew, Interval, KAT2, and Cube2, have been developed to work interchangeably with both the standard and expanded memory chips from NXP. The new antenna designs offer flexibility in the selection of the IC memory based on the application requirements. RSI ID Technologies selected NXP UCODE G2X silicon for passive smart tags and labels based on its reliable operation on different materials, across very long read ranges and in dense reader environments. The G2 XM and XL ICs from NXP offer scalable EPC numbers up to 240 bits and an expanded memory chip that offers an additional 512 bits of user defined memory, which is a benefit for both standard applications and those that require additional memory capacity.

Fill out the form below to request more information about G2: G2: Antenna designs
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?
How AI is reshaping CPG manufacturing operations
Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
Read More
How AI is reshaping CPG manufacturing operations