Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Void-fill system

Fromm Airpad (Naperville, IL) has introduced the Airpad void-fill system, which is said to produce lower cost/cu' than loose-fill, paper, foam or bubble packaging.

The material, which is 99% air and absorbs shipping impact, is generated by feeding two rolls of high-strength film into the Airpad machine. The pads are automatically inflated, sealed in adjustable, tear-to-fit perforated sections and coiled into continuous rolls for ease of placement at packaging stations. The machine can change pad sizes every 30 sec.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing