Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Void-fill system

Fromm Airpad (Naperville, IL) has introduced the Airpad void-fill system, which is said to produce lower cost/cu' than loose-fill, paper, foam or bubble packaging.

The material, which is 99% air and absorbs shipping impact, is generated by feeding two rolls of high-strength film into the Airpad machine. The pads are automatically inflated, sealed in adjustable, tear-to-fit perforated sections and coiled into continuous rolls for ease of placement at packaging stations. The machine can change pad sizes every 30 sec.

Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? <i>Packaging World</i> editors explore the survey responses from 118 brand owners, CPG, and FMCG <i>Packaging World</i> readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO