Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

thermoformers

The multi-purpose thermoformer from Rigo (Milan, Italy) can produce blisters, covers, plates and trays. Both negative and positive molds can be used.

The products are formed and refinished in a die at a single station. Contact-type preheater uses only a fraction of the energy consumed by infrared heaters. Parts are stacked after thermoforming. The machine uses vacuum and pressurized air and is capable of up to 25 cycles/min.

Special Report: Track & Trace
Discover new tools to approach the supply chain that allow you to leverage your data, see real-time visibility, and forecast future sales. You’ll also learn about KH Hive, an in-house digital demand planning tool that Kraft Heinz created to help the company realize its goals, forecasting sales expectation down to the SKU level, location level, and daily level.
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Special Report: Track & Trace
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers