This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.
This compact machine provides high uniformity and tight control over process parameters for highly repeatable results. The system accommodates a wide range of strip sizes. Applications include plasma treatment for pre-die attach, pre-wire bond, pre-mold encapsulation and pre-underfill.
The FlexTRAK-CD system accommodates a wide range of strip sizes, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy. It removes contamination, etches surfaces to improve adhesion, and provides surface activation during electronics manufacturing.
