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Hennepin student receives scholarship

Richard C. Ryan Packaging Education Scholarship goes to Kristin Werner.

Dorner
Dorner

Show Daily Exclusive - The Richard C. Ryan Packaging Education Scholarship, sponsored by Dorner Mfg. (Booth N-4936), was awarded to Kristin Werner, an Automated Robotics Engineering Technology student at Hennepin Technical College in Brooklyn Park, Minnesota.

Werner met rigorous criteria including a GPA of 3.0 or higher, a demonstrated commitment to excellence in the packaging industry and a history of extracurricular involvement at her school. She also wrote an essay describing her career goals in the packaging field.

The $2,000 scholarship, established in honor of Ryan, the former president and CEO of Dorner who passed away suddenly in September 2012, is awarded to a student enrolled in a two- or four-year program at any school partnered with PMMI, The Association for Packaging and Processing Technology (Booth N-4550). Ryan was a member of the PMMI Board of Directors and an advocate of lifelong learning. This commitment to education and PMMI inspired the creation of a scholarship in his name.

β€œYear after year we are impressed with the quality of applicants for the Richard C. Ryan Packaging Education Scholarship,” says Matt Jones, vice president of Sales and Marketing at Dorner. β€œTheir personal commitment to education and self-improvement embody the characteristics we seek in the candidates for this scholarship. It makes the job of selecting only one [recipient] even more difficult.”

The Richard C. Ryan Scholarship is one of several scholarships awarded or administered by the PMMI Foundation, which provides more than $200,000 in funds each year for students at PMMI Partner Schools. These scholarships underscore PMMI’s commitment to the future of the packaging and processing industry.

PMMI U Connection offers many opportunities during PACK EXPO International and the co-located
Healthcare Packaging EXPO to contribute to the PMMI Foundation. Proceeds from events like the Amazing Packaging Race and the new CareerLink @ PACK EXPO interview and networking event contribute directly to PMMI’s scholarship offerings, along with the annual PACK gives BACKβ„’ reception today (Monday, Oct. 15, 2018, 4:30 p.m., Grand Ballroom, South Building, McCormick Place).

For more information, visit www.PMMI.org/workforce-development/foundation. SD

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