Hennepin student receives scholarship

Richard C. Ryan Packaging Education Scholarship goes to Kristin Werner.

Dorner
Dorner

Show Daily Exclusive - The Richard C. Ryan Packaging Education Scholarship, sponsored by Dorner Mfg. (Booth N-4936), was awarded to Kristin Werner, an Automated Robotics Engineering Technology student at Hennepin Technical College in Brooklyn Park, Minnesota.

Werner met rigorous criteria including a GPA of 3.0 or higher, a demonstrated commitment to excellence in the packaging industry and a history of extracurricular involvement at her school. She also wrote an essay describing her career goals in the packaging field.

The $2,000 scholarship, established in honor of Ryan, the former president and CEO of Dorner who passed away suddenly in September 2012, is awarded to a student enrolled in a two- or four-year program at any school partnered with PMMI, The Association for Packaging and Processing Technology (Booth N-4550). Ryan was a member of the PMMI Board of Directors and an advocate of lifelong learning. This commitment to education and PMMI inspired the creation of a scholarship in his name.

“Year after year we are impressed with the quality of applicants for the Richard C. Ryan Packaging Education Scholarship,” says Matt Jones, vice president of Sales and Marketing at Dorner. “Their personal commitment to education and self-improvement embody the characteristics we seek in the candidates for this scholarship. It makes the job of selecting only one [recipient] even more difficult.”

The Richard C. Ryan Scholarship is one of several scholarships awarded or administered by the PMMI Foundation, which provides more than $200,000 in funds each year for students at PMMI Partner Schools. These scholarships underscore PMMI’s commitment to the future of the packaging and processing industry.

PMMI U Connection offers many opportunities during PACK EXPO International and the co-located
Healthcare Packaging EXPO to contribute to the PMMI Foundation. Proceeds from events like the Amazing Packaging Race and the new CareerLink @ PACK EXPO interview and networking event contribute directly to PMMI’s scholarship offerings, along with the annual PACK gives BACK™ reception today (Monday, Oct. 15, 2018, 4:30 p.m., Grand Ballroom, South Building, McCormick Place).

For more information, visit www.PMMI.org/workforce-development/foundation. SD

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