Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Balluff: UV luminescence sensor

Balluff’s BLT 31M sensor effectively detects UV luminescent materials and markers with a range of 300 mm.

Pw 8482 C Balluff

Extended sensing range allows sensor to be mounted out of the way of the manufacturing process, therefore avoiding incidental contact. Response time of 6 kHz makes it suitable for high-speed packaging applications. With assistance of an optional 50-mm lens, the projected UV light can be directed into a 5-mm spot.

Phone: 800/543-8390

www.balluff.com

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Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers