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"Glue-free" labeling solution creates a buzz in WLS booth!
WLS introduction of a "glue-free" cut-and-stack labeling technology combined with a demonstration of its pressure-sensitive labeling serialization capabilities result in a highly successful Pack Expo 2014.
Nov 20, 2014
Machinery Basics
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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