Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

OFF THE SHELF: Conagra's bag-to-bowl technology

Now available nationwide, this microwave popcorn package goes from flat bag to a bowl brimming with delicious popcorn. Pat Reynolds puts the new package through the paces.

Do you have a package that you think would be interesting for Off the Shelf? Send it to the editors for consideration at:


Packaging World Magazine
ATTN: Off the Shelf
330 N. Wabash Ave., Suite 2401
Chicago, IL 60611

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers