Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Wireless IO-Link Master For Remote Motion Control

SMC’s next-gen wireless base module gets reduced in size and adds flexible connectivity capabilities.

SMC
SMC

SMC showcased a sample of the next generation of its traditional wireless base modules during PACK EXPO 2019. The next iteration of the wireless base takes up 50% less space and has a remote antenna that can be mounted onto a control panel. This antenna has an IP66 washdown rating so it can be exposed to harsh conditions. 

 

While this is just a concept for SMC, the company expects this technology to be available for purchase within the next four to six months. 

Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!
Is your palletizing solution leaving money on the floor?
Discover which palletizing technology—robotic, conventional, or hybrid—will maximize your packaging line efficiency while minimizing long-term costs in this comprehensive analysis.
Read More
Is your palletizing solution leaving money on the floor?