See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW & SAVE

Wireless IO-Link Master For Remote Motion Control

SMC’s next-gen wireless base module gets reduced in size and adds flexible connectivity capabilities.

SMC
SMC

SMC showcased a sample of the next generation of its traditional wireless base modules during PACK EXPO 2019. The next iteration of the wireless base takes up 50% less space and has a remote antenna that can be mounted onto a control panel. This antenna has an IP66 washdown rating so it can be exposed to harsh conditions. 

 

While this is just a concept for SMC, the company expects this technology to be available for purchase within the next four to six months. 

Retail multipack suppliers, all in one place
25+ vetted systems for cups, tubs, and bottles — shrink, paperboard, banding, clip, and more. Free download.
Read More
Retail multipack suppliers, all in one place
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International