Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Mitsubishi HiTec Paper: Coated specialty papers

Mitsubishi HiTec Paper offers THERMOSCRIPT® thermal papers, JETSCRIPT® inkjet papers, GIROFORM® carbonless papers, and BARRICOTE® barrier papers designed for label and packaging applications.

Coated specialty papers
Coated specialty papers

THERMOSCRIPT® thermal papers: the demand for phenol-free thermal paper is rising significantly. Mitsubishi has been using phenol-free developers for thermal papers for many years; with and without topcoat; for labels, tickets, receipts or lottery tickets, including integrated security features. Linerless is a fast-growing label segment. The THERMOSCRIPT LL 77 series of thermal papers, launched at Labelexpo Europe 2017 in Brussels, offer a cost-effective linerless solution; also phenol-free of course.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers