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ARPAC receives innovation award from Yaskawa

ARPAC awarded Yaskawa's 2014 Innovation Award for Outstanding Applications of Robotic Technology.

ARPAC accomplished multiple robotic applications involving vision and corner board placement. ARPAC has successfully developed key technologies and designs that provide unique processes in the consumer packaging arena. This is coupled with the ability to engineer complete turnkey integrated production line solutions to leading organizations.

ARPAC and Yaskawa have been developing a partnership over the last six years and ARPAC is pleased to accept the award for innovative use of robotics to address customer challenges.

ARPAC specializes in integration projects ranging from a few strategically matched machines to complex systems incorporating equipment from multiple OEM sources. Our expertise includes primary packaging, bundlers, wrappers, case/tray formers, shrink tunnels, palletizers, robots, and virtually all types of material handling hardware. ARPAC has more than 30 design engineers and an applications development team to design, develop and manufacture complex integrated systems. Additionally, ARPAC designs and programs control systems in-house with the floor capacity to assemble large integrated systems and test them in their entirety!

ARPAC’s extensive integration capabilities allow us to design, build, and install custom manufacturing systems that meet and exceed specific production requirements. The benefits of turnkey integration include: consistent design, programs, HMIs, and documentation. Additionally, this provides the benefits of a single source supplier, which include centralized project management, support, testing, training, parts, and service.

ARPAC’s wide product offering, experienced technical staff and state-of-the-art manufacturing capabilities make us the perfect partner for your next integration project. ARPAC’s headquarters, manufacturing, training facility and showroom are centrally located in Schiller Park, IL near Chicago’s O’Hare airport.

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