See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW & SAVE

Create a free Packaging World account to continue reading

Mitsubishi Electric Automation: Industrial PC

Mitsubishi Electric's new WinCPU industrial PC seamlessly integrates with the company’s popular PAC system, the iQ Platform.

Pw 45365 Win Cpu R 0

This fully functional PC mounts directly to the back plane of the iQ-Series controller and is suitable for machine builders who require synergy among high-level computing, multi-level processing and non-traditional control. The WinCPU features a 1.66GHz Atom processor and solid state memory (SSD). This helps assure high functionality, interoperability, and ease-of-use for most factory or process control applications.

This WinCPU helps end-users achieve: tighter integration between control and computing technologies; simplified designs and smaller footprints; reduced system and engineering costs; lower TCO and maintenance requirements; and increased flexibility.
 

Need help with your packaging project?
We’ve done the legwork to identify and vet experienced packaging and processing consultants you can contact directly for your next project. Decades of combined experience in packaging line engineering, machinery selection, package and materials development, and food processing operations.
See your advisor options now.
Need help with your packaging project?
Retail multipack suppliers, all in one place
25+ vetted systems for cups, tubs, and bottles — shrink, paperboard, banding, clip, and more. Free download.
Read More
Retail multipack suppliers, all in one place