Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.

Advantech Automation Corp.: Intel-based platforms for cloud, video and communication infrastructure applications

Advantech’s Intel-based solutions range from Intel® Core™ i7 processor AMCs to 40G AdvancedTCA Systems with dual Intel® Xeon® processor blades.

Equipment is designed for small-to-medium business appliances and servers to datacenter-hosted cloud network platforms. Solutions are used to power mission-critical communication infrastructure and enterprise networking applications. The systems can be incrementally upgraded as next-generation Intel® processors and 40 GbE controllers become available.
Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
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Conveying Innovations Report
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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Annual Outlook Report: Workforce