Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
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Advantech Automation Corp.: Intel-based platforms for cloud, video and communication infrastructure applications

Advantech’s Intel-based solutions range from Intel® Core™ i7 processor AMCs to 40G AdvancedTCA Systems with dual Intel® Xeon® processor blades.

Equipment is designed for small-to-medium business appliances and servers to datacenter-hosted cloud network platforms. Solutions are used to power mission-critical communication infrastructure and enterprise networking applications. The systems can be incrementally upgraded as next-generation Intel® processors and 40 GbE controllers become available.
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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Annual Outlook Report: Workforce
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!