See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW & SAVE

Create a free Packaging World account to continue reading

Advantech Automation Corp.: Intel-based platforms for cloud, video and communication infrastructure applications

Advantech’s Intel-based solutions range from Intel® Core™ i7 processor AMCs to 40G AdvancedTCA Systems with dual Intel® Xeon® processor blades.

Equipment is designed for small-to-medium business appliances and servers to datacenter-hosted cloud network platforms. Solutions are used to power mission-critical communication infrastructure and enterprise networking applications. The systems can be incrementally upgraded as next-generation Intel® processors and 40 GbE controllers become available.
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International
Co-packers: the competitive gap is widening
Brands want more than low bids. See what automation, services, and sustainability mean for CM/CPs in 2026.
Read More
Co-packers: the competitive gap is widening