Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 ā€“ 6 in Chicago.

Omron Scientific Technologies, Inc: Module monitors sends non-safety data

The EIP module for G9SP programmable safety controllers from Omron Scientific Technologies Inc. enables programmable devices that follow ODVA guidelines for EtherNet/IPā„¢ to communicate with G9SP controllers.

Pw 2033 Webpmron
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing