Scholarship Encourages Future Leaders in Packaging

Established this year to support and foster packaging education, the $2500 educational scholarship will be presented to a promising undergraduate student who is pursuing a Packaging Science degree from Clemson University. The Future Leaders in Packaging Scholarship has been developed in conjunction with Packaging World's Leadership in Packaging program, a community-based print and online program that enables suppliers to promote their innovation and commitment to the packaging community. “Packaging World has been a long time supporter of packaging education, via various association initiatives and editorially,” says Packaging World Publisher Joe Angel. “We're very excited to add this annual scholarship to our Leadership in Packaging program, and honored to co-sponsor the 2012 award with Printpack.” Based on Printpack's participation in the 2011 Leadership in Packaging program and their outstanding effort to promote voter participation, they were given the honor of choosing the packaging school to receive this year's scholarship and are being named with Packaging World as the donor of the scholarship.

“Printpack is honored to be named the Promotional Leader of the 2011 Leadership in Packaging competition and we appreciate the support from our customers that made this award possible,” says Vice President of Technology & Support Terry Harper. “We are especially proud to announce that the 2012 Future Leaders in Packaging Scholarship will go to Clemson University, with whom we have had a long and productive relationship.” Applicants for the 2012 award must be undergraduate degree candidates in Clemson University's Department of Packaging Science. Clemson's packaging science department scholarship review board will select the 2012 recipient. For more information, or to apply for the scholarship, please connect with Professor and Chair, Dr. Anthony L. Pometto III of the Department of Food, Nutrition, and Packaging Sciences.