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Call for papers

Packaging World and Automation World are seeking speakers for the second edition of the Packaging Automation Forum, scheduled for mid to late May 2007 in Chicago.

Speakers who can address issues directly relating to controls and automation in the world of packaging lines and packaging machinery are encouraged to contact Packaging World Editor Pat Reynolds to discuss speaker opportunities. Possible topics might include these:

*Improved methods of collecting data from packaging machinery and feeding that data automatically to MES and ERP.

*Calculating Overall Equipment Efficiency.

*Using improved controls and automation technology to simplify validation in the drug manufacturing arena.

*How to achieve top-floor-to-shop-floor data flow.

*Integrating packaging lines in an automated, recipe-driven approach to handling process orders.

*Operating improvements and efficiencies gained through implementation of PackML guidelines.

*How greater use of widely recognized standards helped integrate the processing and packaging sides of our manufacturing house.

*What packaging machinery OEMs and the technology providers they rely on need to do differently in the way they approach controls.

*Advances in servo-based technology.

*How better use of controls and automation technologies position packaged goods companies to respond to market demand signals, reduce inventory, and increase speed to market.

*Last year's Packaging Automation Forum sold out, even though it was a first-time event. From all indications, this year's event will be well attended, too.

*Speakers we'd like to attract should come primarily from the packaged goods manufacturing sector. Some packaging machinery OEMs might be considered--provided their presentation focuses on trends and technologies as opposed to sales of their own products.

*Also available are a limited number of sponsorships; to learn more about these, contact Packaging World Associate Publisher Jim Chrzan at [email protected]. To discuss speaking opportunities, contact Packaging World Editor Pat Reynolds at [email protected].

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