Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

New blister thermoformer features modular design, high performance touch panel

Pw 29939 S53

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

PharmaWorks (PACK EXPO Booth C-4006) will equip its large format (220mm x 290mm) TF3 blister thermoformer with a sleek new Intel® Atom™ powered, IP65 rated touchscreen PC from B&R that allows them to replace a separate HMI and industrial PC.

The sealed aluminum HMI panel runs Factory Talk® View Machine Edition, combining a single protected operator interface with the ability to run the Windows™ applications that are increasingly important for production management, OEE, vision, video and serialization applications.

Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—<i>Packaging World</i> editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report