Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Dow Corning: Release additive technology

Syl-Off® SL 35 Release Modifier is the next generation of controlled release additive technology for solventless release coatings.

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

Syl-Off SL 35 Release Modifier offers tight release at very low platinum (Pt) levels with superior stability and shelf life. Designed for low-platinum, solventless systems, it leverages the potential of Dow Corning’s Syl-Off Advantage Series Solventless Systems to give customers the best in both quality control and cost savings. It is suitable for use in the manufacturing of pressure sensitive label stock, single- and double-sided release papers, liners for adhesive tapes and other coatings for sticky materials.
 

Fill out the form below to request more information about Dow Corning: Release additive technology
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!