Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

BASF Corp.: HIPS resin

BASF Corp.’s (Mount Olive, NJ) 496N high-impact polystyrene (HIPS) resin is designed for extrusion thermoforming and injection molding. Can be blended with cost-saving, general-purpose polystyrene.

It also gives the processor the flexibility to “dial-in” different blending ratios to meet a variety of packaging applications, thus eliminating the need to carry specific products for certain applications. Suitable for applications in food packaging, cups, lids, plates, and containers.

Fill out the form below to request more information about BASF Corp.: HIPS resin
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce