Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Applications news

Oskosh, WI-based OEC Graphics is reported to be the first in the U.S. to install the digilas® computer-to-plate system made by Schepers of Germany.

Pw 23495 Osk Wioec Gra 34

Added earlier this year, the system permits OEC to produce seamless photopolymer printing sleeves directly from computer data. OEC president Jack Schloesser says, "For several years we have searched for a system that would produce photopolymer plates without the typical problems of light scatter and emulsion shift associated with film. We analyzed every system available and determined that digilas offered us greater flexibility along with the cost and time- saving advantages of automatic balancing." The digilas system is distributed in North America by NAPP Systems (San Marcos, CA).

Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce