Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 ā€“ 6 in Chicago.

Weiler Labeling's glue-free labeling system

Weiler Labeling Systems (WLS) is introducing its new RL-840N ā€œglue-freeā€ cut-and-stack labeler at Pack Expo 2014 (booth S-4172). The RL-840N uses NuLabelā€™s activatable adhesive technology and eliminates the need for glue to apply the label. By removing the glue this technology achieves the lower cost of cut-and-stack labels and the efficiency of pressure-sensitive labelers.

This content was written and submitted by the supplier. It has only been modified to comply with this publicationā€™s space and style.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing