Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

100 to 400-ppm linerless label system debuts

WS Packaging has introduced a high-speed linerless label system, in both an in-line and rotary applicator format, that can operate at speeds from 100 to 400 packages/min, respectively. A patented microperf on the WS-supplied clear or white BOPP labelstock results in a no-label look for applications in the beverage, health and beauty, and personal care categories. System is said to provide an 8% to 20% savings in total applied costs.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers