Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Efector, Inc: Photoelectric sensor

The OG Series photoelectric sensors from efector inc. (Exton, PA) offer the reliability of automatic microprocessor setups in an 18-mm body size. During installation, it "learns" the signal strength characteristics of both target-present and target-not-present conditions.

Pw 22653 The Og Serpho 15
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers