Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

End-of-Line Automation: Risk Reduction Through Digital Twin Technology

See how digital twin technology can speed design and concept level processes for risk reduction and faster machine development solutions.

Shawn Cheney, Chief Controls Engineer at Pearson Packaging Systems,
Shawn Cheney, Chief Controls Engineer at Pearson Packaging Systems,

Shawn Cheney, Chief Controls Engineer at Pearson Packaging Systems, discussed digital twin technology at today’s PACK EXPO Connects Innovation Stage. “Digital twin technology,” said Cheney, “allows us to be able to animate, simulate and emulate, to be able to achieve a risk reduction for all stakeholders involved in a project.”

Cheney said this can be done on an individual process level, on discreet equipment, or at a system level with many pieces of equipment all tied together, allowing us to accelerate through the design and concept level processes and reach a final solution much faster than is traditionally done.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing