Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Herrmann marks 25th year with special edition ultrasonic welder

Herrmann Ultrasonics, Inc., introduces anniversary edition HiQ Medialog welding machine with new features.

In 1990, Thomas Herrmann, the son of Walter Herrmann, who founded Herrmann Ultraschalltechnik GmbH in 1961, established Herrmann Ultrasonics Inc. in the Chicago area. Hermann Ultrasonics, Inc. is proud to recognize a milestone year in observance of their 25th anniversary.

Herrmann Ultrasonics has been focused on providing ultrasonic welding technology for various markets such as the medical, automotive, consumer, electronics, food, and hygiene industry. The company has become the technology leader in ultrasonic welding by developing the most advanced products, providing ultrasonics engineering expertise, and total solution offerings.

Continuous growth of its plastic, packaging, and nonwovens divisions has allowed the company to establish Technology Centers throughout North America. The 20,000-sq.-ft. facility, located in Bartlett, IL has been managed by Uwe Peregi since 2006. This modern and advanced facility allows Herrmann Ultrasonics to provide feasibility studies and trial runs in one of the three laboratories. Fast tooling delivery is standard due to in-house vertical integrated 3D tooling design and CNC manufacturing.

In honor of the significant occasion, Herrmann Ultrasonics will launch an anniversary edition of the proven HiQ Medialog ultrasonic welding machine. This welder was inspired by Executive VP and General Manager Uwe Peregi and is mostly used by medical device manufacturers. A new look, cleanroom-friendly surfaces, additional safety features, and exhausts to control particles contribute to the uniqueness of the HiQ Medialog. The machine also includes the operator interface FSC, which meets the requirements of FDA CFR 21 part 11.

Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report
Pharmaceutical Innovations Report
Discover the latest breakthrough packaging technologies shaping the pharmaceutical sector. This report dives into cutting-edge innovations, from smart containers that enhance patient safety to eco-friendly materials poised to transform the industry’s sustainability practices. All from PACK EXPO. Learn how forward-thinking strategies are driving efficiency and redefining what’s possible in pharma packaging.
Learn More
Pharmaceutical Innovations Report